EcoPeeler for Logic Process (For 45nm and Beyond) :
EcoPeeler dose not contain any HDA(hydroxyl amine), hazardous, toxicor organic solvents.
It is not also necessary for additional facilities and cost associated with its disposal.
Ecological Chemicals for Human and Environment.
No damage on low-k material – proven by FTIR etc.
CuOx/CuO selectivity adjustable
< 0.4nm Cu etching amount
> 25nm/min CuO etching rate
Conservation of Critical Dimensions (CD)
Post-ash polymer removal
Optimum Inter-Layer-Dielectric (ILD) etching selectivity
No attack to High-k materials (HfO2 etc.)
Used for High Dose Implant Stripping (HDIS) post ash cleaning for minimum material loss
Applicable for Carbon-Nano-Tube (CNT) wet chemistry cleaning processes
No attack to CoSi/NiSi/NiPtSi/NiPdSi
User and environmental friendly
SEM Image of W Plug